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GSI Lasers launches JK100P

2mm thick monocrystalline silicon material, cutting speed >0.15m/min

New from GSI Lasers (Rugby, UK), the JK100P, 100W Nd:YAG short-pulsed laser combines high peak power (10kW), short pulses (15-200us),and high repetition rates (2000Hz) to make this laser ideal for cutting thick sections of silicon wafers and other similar materials.

The laser also can be used for scribing or drilling holes and, due to the pulse regime, can enable high aspect ratio cutting in thick section silicon but eradicate micro-cracking that is usually caused by excessive heat input.

Other features include the LaserView control technology, which enables complete cycle programming triggered by a single command, Luminator fiber optic beam delivery with back reflection protection, faster shutter interface and fully integrated time and energy shares for faster switching and reduction in maintenance costs.

Wed Nov 12 11:53:00 CST 2008


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